Thermal Grizzly Minus Pad 8 Thermal Pad 2-Pack (120x20x1.0mm)
700EGP
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Thermal Conductivity (k): 8.0 W/mK.
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Dimensions (per pad): 120 mm x 20 mm.
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Thickness: 1.0 mm.
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Quantity: 2 Pads per package.
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Key Feature: Highly elastic, non-capacitive, long-term stability.
3 in stock
Description
The Thermal Grizzly Minus Pad 8 offers a highly effective, long-lasting thermal solution for components that require padding rather than paste, such as MOSFETs, VRAM modules, and chipsets. This specific product package contains two individual pads, each measuring 120mm x 20mm with a thickness of 1.0mm, providing excellent coverage for custom cutting. With a superior thermal conductivity rating of 8.0 Watts per meter-Kelvin (W/mK), the pads rapidly conduct heat away from electronic parts. Their unique, flexible silicone-based compound allows them to adapt perfectly to microscopic surface irregularities and fill gaps easily, creating optimal contact. The Minus Pad 8 is highly elastic, non-curing, and completely non-electrically conductive, ensuring safe installation and maintaining stable performance across a vast operational temperature range from
| Feature | Benefit |
| High Thermal Conductivity (8.0 W/mK) | Provides efficient and immediate heat transfer from critical components to the heatsink, improving stability. |
| 2-Pack (Dual Pads) | Offers double the material for more extensive application coverage across a motherboard, graphics card, or laptop components. |
| Highly Elastic and Flexible | Conforms easily to non-flat or irregular surfaces, eliminating the need for precise gap measurements found in some pad applications. |
| Non-Electrical Conductive | Guarantees safety and prevents accidental short-circuits when applied near power delivery systems. |
| Long-Term Performance | Non-curing formula ensures the pads maintain their softness and thermal properties over the product's lifespan. |
| Component | Specification |
| Brand | Thermal Grizzly |
| Model | Minus Pad 8 |
| Part Number | TG-MP8-120-20-10-2R |
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